It was then possible to first solder the base using standard methods and then to replace the plastic body afterward. It was then the engineers noticed that the main body was detachable from the PCB FR4 base. There was no allowance for a re-design or part substitution. Parts of the component body melted long before the solder paste did, resultingĪt this stage, the customer’s design was complete, all theĬomponents had been procured and the conference date was approaching fast. Guns were carefully used to direct heat onto the contacts. The pads were located on the bottom side, solder paste was applied and hot air Firstly,Īll the other surface mount parts were mounted onto the boards as usual. The engineers then tried to solder them manually. It was clearly not enough, as the first test samples came out of the reflow oven with the melted mess below. The engineers followed a general reflow profile with minor compensation for the plastic part. The datasheet had none of this information anyway). Reflow profile or the maximum temperature tolerance (it was later revealed that However, without the datasheet, we had neither the recommended Largely made out of plastic, the joystick clearly required Given the strict deadline, the decision was made to do without it. One component consisted of a joystick, provided directly by the customer but we did not have access to the datasheet. Making the deadline was absolutely paramount and we were not left with much room for error. In this particular case study, the client was preparing a handheld games console to serve as a gift for guests at an upcoming conference.
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